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Surface Mount Varistors
Multilayer Transient Voltage Suppressor
MLE Varistor Series
The MLE Series family of Transient Voltage Suppression devices are based on the Littelfuse Multilayer fabrication technology. These components are designed to suppress ESD events, including those specified in IEC 610004-2 or other standards used for Electromagnetic Compliance testing. The MLE Series is typically applied to protect integrated circuits and other components at the circuit board level operating at 18VDC, or less. The fabrication method and materials of these devices result in capacitance characteristics suitable for high frequency attenuation/low-pass filter circuit functions, thereby providing suppression and filtering in a single device. The MLE Series is manufactured from semiconducting ceramics and is supplied in a leadless, surface mount package. The MLE Series is compatible with modern reflow and wave soldering procedures. Littelfuse Inc. manufactures other Multilayer Series products. See the ML Series data sheet for higher energy/peak current transient applications. See the AUML Series for automotive applications and the MLN Quad Array. For high speed applications see the MHS series.
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SURFACE MOUNT VARISTORS
133
Features
* Rated for ESD (IEC-61000-4-2) * Characterized for Impedance and Capacitance *-55oC to +125oC Operating Temperature Range * Leadless 0402, 0603, 0805, and 1206 sizes * Operating Voltages up to 18VM(DC) * Multilayer Ceramic Construction Technology
Applications
* Protection of Components and Circuits Sensitive to ESD Transients Occurring on Power Supplies, Control and Signal Lines * Suppression of ESD Events Such as Specified in IEC-61000-4-2 or MIL-STD-883C Method-3015.7, for Electromagnetic Compliance (EMC) * Used in Mobile Communications, Computer/EDP Products, Medical Products, Hand Held/Portable Devices, Industrial Equipment, Including Diagnostic Port Protection and I/O Interfaces
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Surface Mount Varistors
Multilayer Transient Voltage Suppressor
MLE Varistor Series
Absolute Maximum Ratings
For ratings of individual members of a series, see device ratings and specifications table.
Continuous: MLE SERIES Steady State Applied Voltage: DC Voltage Range (VM(DC)) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Operating Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 125 Storage Temperature Range (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 150
UNITS
V C O C
O
Device Ratings and Specifications
MAX CONTINUOUS WORKING VOLTAGE -55oC TO 125oC (NOTE 1) VM(DC) PART NUMBER PERFORMANCE SPECIFICATIONS (25 oC) NOMINAL VOLTAGE VNOM AT 1mA DC MAX (V) 28
MAXIMUM CLAMPING VOLTAGE AT SPECIFIED CURRENT (8/20S) MAXIMUM ESD CLAMP VOLTAGE (NOTE 2)
Vc
(NOTE 3) 8kV CONTACT Clamp (V) <125
(NOTE 4) 15kV AIR Clamp (V) <160
TYPICAL CAPACITANCE AT 1MHz
MAXIMUM LEAKAGE I L MAX AT APPLIED VOLTAGE
(V) 18
MIN (V) 22
(V) 50 at 10A
( pF) <40
( A) 0.1 0.3 2 10
V DC 3.5 5.5 15 18 3.5 5.5 15 18 3.5 5.5 15 18 3.5 5.5 15 18 3.5 5.5 15 18 3.5 5.5 15 18
NEW
V18MLE0402
V18MLE0603
18
22
28
50 at 10A
<75
<85
<100
0.1 0.3 5.0 25
V18MLE0603L
18
22
28
50 at 10A
<100
<140
<60
0.1 0.3 5.0 25
V18MLE0805
18
22
28
50 at 10A
<70
<75
<500
0.2 0.5 5.0 25
V18MLE0805L
18
22
28
50 at 10A
<75
<135
<100
0.2 0.5 5.0 25
V18MLE1206
18
22
28
50 at 10A
<65
<65
<1700
0.5 1.0 5.0 25
NOTES: 1. For applications of 18VDC or less. Higher voltages available, contact your Littelfuse Sales Representative. 2. Tested with IEC-61000-4-2 Human Body Model (HBM) discharge test circuit. 3. Direct discharge to device terminals (IEC preferred test method). 4. Corona discharge through air (represents actual ESD event). 5. Capacitance may be customized, contact your Littelfuse Sales Representative.
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Surface Mount Varistors
Multilayer Transient Voltage Suppressor
MLE Varistor Series
Typical Performance Curves
For applications exceeding 1250C ambient temperature, the peak surge current and energy ratings must be reduced as shown in Figure 1.
30 NOMINAL VOLTAGE AT 1mADC 100 PERCENT OF RATED VALUE 25 20
80
60
3
10 5 0
40
20
0 -55
50
60
70
80
90
100
110 120
130 140 150
1
10
100 CURRENT (A)
1000
10000
AMBIENT TEMPERATURE ( oC)
FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE
FIGURE 2. NOMINAL VOLTAGE STABILITY TO MULTIPLE ESD IMPULSES (8KV CONTACT DISCHARGES PER IEC 61000-4-2)
30 25 VARISTOR VOLTAGE (V) 20 15 10 5 10 0.0001 0.001 0.01 0.1 1 NUMBER OF PULSES 125O 25O
100
-0402 10 -0603 -0805 IMPEDANCE (Z) 1 -1206
85O
0.1
FIGURE 3. STANDBY CURRENT AT NORMALIZED VARISTOR VOLTAGE AND TEMPERATURE
0.01 10 100 1000 FREQUENCY (MHz) 10000
FIGURE 4. IMPEDANCE (Z) vs FREQUENCY TYPICAL CHARACTERISTIC
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SURFACE MOUNT VARISTORS
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Surface Mount Varistors
Multilayer Transient Voltage Suppressor
MLE Varistor Series
Soldering Recommendations
TEMPERATURE ( oC) 250 MAXIMUM TEMPERATURE 222 oC 200 40-80 SECONDS ABOVE 183 oC RAMP RA TE <2oC/s 100 PREHEAT DWELL 50 PREHEAT ZONE
The principal techniques used for the soldering of components in surface mount technology are Infrared (IR) re-flow, vapour phase re-flow, and wave soldering. When wave soldering, the MLE suppressor is attached to the circuit board by means of an adhesive. The assembly is then placed on a conveyor and run through the soldering process to contact the wave. With IR and vapour phase re-flow, the device is placed in a solder paste on the substrate. As the solder paste is heated, it reflows and solders the unit to the board. The recommended solder for the MLE suppressor is a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb), or 63/37 (Sn/Pb). Littelfuse also recommends an RMA solder flux. Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. For 0402 size devices, IR re-flow is recommended. When using a reflow process, care should be taken to ensure that the MLE chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. Examples of the soldering conditions for the MLE series of suppressors are given in the tables below. Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 50oC before cleaning.
150
0 0
0.5
1.0
1.5 2.0 2.5 TIME (MINUTES)
3.0
3.5
4.0
FIGURE 5. REFLOW SOLDER PROFILE
300 MAXIMUM WAVE 260 oC 250 TEMPERATURE ( oC) 200 150 SECOND PREHEAT 100 FIRST PREHEAT 50 0 0
Termination Options
Littelfuse offers two types of electrode termination finish for the MLE series: 1. Silver/Platinum (standard) (Not 0402 and 0603 sizes) 2. Silver/Palladium (optional) 3. Nickel Barrier (optional for 0402-1210 package size) (The ordering information section describes how to designate them.)
0.5
1.0
1.5
2.0 2.5 3.0 TIME (MINUTES)
3.5
4.0
4.5
FIGURE 6. WAVE SOLDER PROFILE
250 MAXIMUM TEMPERATURE 222 oC 200 TEMPERATURE ( oC) 40-80 SECONDS ABOVE 183 oC RAMP RA TE >50oC/s 100 PREHEAT ZONE 50
150
0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 TIME (MINUTES)
FIGURE 7. VAPOR PHASE SOLDER PROFILE
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Surface Mount Varistors
Multilayer Transient Voltage Suppressor
MLE Varistor Series
Recommended Pad Outline
C
B
NOTE
3
NOTE: Avoid metal runs in this area.
TABLE 1: PAD LAYOUT DIMENSIONS RECOMMENDED PAD SIZE DIMENSIONS 1206 SIZE DEVICE DIMENSION A B C IN 0.160 0.065 0.040 MM 4.06 1.65 1.02 0805 SIZE DEVICE IN 0.120 0.050 0.040 MM 3.05 1.27 1.02 0603 SIZE DEVICE IN 0.100 0.030 0.035 MM 2.54 0.76 0.89 0402 SIZE DEVICE IN 0.067 0.020 0.024 MM 1.70 0.51 0.61
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SURFACE MOUNT VARISTORS
A
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Surface Mount Varistors
Multilayer Transient Voltage Suppressor
MLE Varistor Series
Mechanical Dimensions
E
D L W
DEVICE DIMENSIONS 1206 SIZE DIMENSION D Max E L W IN 0.071 0.020.01 0.1250.012 0.060.011 MM 1.80 0.500.25 3.200.03 1.600.28 IN 0.043 0.020.01 0.0790.008 0.0490.008 0805 SIZE MM 1.1 0.500.25 2.010.2 1.250.2 IN 0.035 0.0150.008 0.0630.006 0.0320.006 0603 SIZE MM 0.9 0.40.2 1.60.15 0.80.15 IN 0.024 0.0100.006 0.0390.004 0.0200.004 0402 SIZE MM 0.6 0.250.15 1.00.1 0.50.1
Ordering Information
VXXMLE TYPES
V
18
MLE 1206
X
X
X
DEVICE FAMILY Littelfuse TVSS Device MAXIMUM DC WORKING VOLTAGE MULTILAYER SERIES DESIGNATOR
PACKING OPTIONS A: Bulk Pack (not 0402 size) H: 7in (178mm) Diameter Reel T: 13in (330mm) Diameter Reel (not 0402 size) END TERMINATION OPTION No Letter: Ag/Pt (Standard) W: Ag/Pd N: Nickel Barrier (0402-1210) For 0402 package size, Nickel Barrier termination is subject to availibility. Please contact a Littelfuse sales representative. CAPACITANCE OPTION No Letter: Standard L: Low Capacitance Version
DEVICE SIZE: i.e., 120 mil x 60 mil
(3mm x 1.5mm)
Standard Shipping Quantities
DEVICE SIZE 1206 0805 0603 0402
138
"13"INCH REEL ("T"OPTION) 10,000 10,000 10,000 N/A
"7"INCH REEL ("H"OPTION) 2,500 2,500 2,500 10,000
BULK PACK ("A"OPTION) 2500 2500 2500 N/A
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Surface Mount Varistors
Multilayer Transient Voltage Suppressor
MLE Varistor Series
Tape and Reel Specifications
* Conforms to EIA - 481-1, Revision A * Can be supplied to IEC publication 286 - 3
SYMBOL A0 B0 K0 W F E P1 P2 P0 D0 D1 T 1 Width of Cavity Length of Cavity Depth of Cavity Width of Tape Distance Between Drive Hole Centers and Cavity Centers Distance Between Drive Hole Centers and Tape Edge Distance Between Cavity Centers Axial Drive Distance Between Drive Hole Centers & Cavity Centers Axial Drive Distance Between Drive Hole Centers Drive Hole Diameter Diameter of Cavity Piercing Top Tape Thickness
N/A 20.05
DESCRIPTION
DIMENSIONS IN MILLIMETERS
0402 Size 0603, 0805, & 1206 Sizes
Dependent on Chip Size to Minimize Rotation. Dependent on Chip Size to Minimize Rotation. Dependent on Chip Size to Minimize Rotation. 8 0.2 3.5 0.05 1.75 0.1 4 0.1 2 0.1 4 0.1 1.55 0.05 1.05 0.05 0.1 Max
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SURFACE MOUNT VARISTORS
139
D0
P0 P2 E
F K0 B0
W
t1
D1
P1
A0
PRODUCT IDENTIFYING LABEL PLASTIC CARRIERTAPE
EMBOSSMENT TOP TAPE
8mm NOMINAL
178mm OR 330mm DIA. REEL
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